Lugar del origen
Guangdong, China
Número de Modelo
Thermal pad T1.003
Tipo
Thermal conductive pad
Resistencia a la tracción
10-12MPa
products name
Themal Conductive Silicone Pad
Type
Silicon thermally conductive gap filling material
Application
Communication equipment,Memory module,Heat pipe assembly,etc.
Size
200*300*2.0mm,customize
operating temperature
-50-200℃
Thermal Conductivity
1-5W/m.K,≥6W/m.K
Breakdown Voltage
>6000 Vac/mm
Style
Themal Conductive cooling pads
color
Wathet,light purple,Pink,Gray,Customizable