Lugar del origen
Guangdong, China
Materia prima principal
Epoxi
Aplicación
Construcción, Embalaje, underfill flip-chip
Otros Nombres
Quickly and effectively fill chip bottom tiny gap
Clasificación
Otros adhesivos
Tipo
Quickly and effectively fill chip bottom tiny gap
Product name
Quickly and effectively filling chip bottom tiny gap potting adhesive
Curing method
Low temperature curing
Product Description
Rapid curing, low viscosity
Application scenario
Chip bottom filling
Curing conditions
15min @ 120℃