Lugar del origen
Guangdong, China
Tamaño del agujero mín.
0.3mm
Acabado de la superficie
OSP,HASLLF ,ENIG,Silver, Tin
Tamaño del tablero
510mm*460mm
Assembly Type
FPC, FR4, Rigid-flex pcb, mcpcb
Min Assembly Specification
50mm*50mm
Max Assembly Specification
510mm*460mm
Components DIP
01005 Chip/0.35 Pitch BGA
Min device accuracy
+/- 0.04mm
Min footprint distance
0.3mm
Application
Telecommunication, Computer Application, Consumption Electronics