Número de Modelo
Custom PCB & PCB Assembly
Lugar del origen
Guangdong, China
Grosor del cobre
0.4-2mil(10-50um)
Tamaño del agujero mín.
0.1mm(4mil)for HDI / 0.15mm(6mil)
Ancho de línea mín.
0.075mm/0.075mm(3mil/3mil)
Acabado de la superficie
HASL/OSP/Ag/ENIG/ENEPIG/Immersion silver/Tin
PCB Test
Flying probe and AOI (Default)/Fixture Test
BGA Ball Pitch
1mm ~ 3mm(4mil ~ 12mil)
PCB Assembly Method
SMT, Through-hole, Mixed, BGA
PCB Assembly Test
Visual Inspection (default), AOI, FCT, X-RAY
Electrical Testing
Net List Test, Flying Probe Test, Through Hole Test, Dual Access Test
Certificate Standard
IPC-A-600H Class 2, Class 3, TS16949,ROHS and as your need
Special requirements
Buried and blind vias, Impedance control, via plug, BGA soldering etc.
Base Material
FR-4,Hi-TG FR4,CEM-1,CEM-3
Surface Finishing
HAL, HASL Lead Free, ENIG