Lugar del origen
Guangdong, China
Grosor del cobre
1OZ 2OZ 3OZ 4OZ 5OZ 6OZ
Tamaño del agujero mín.
0.3mm
Acabado de la superficie
HASL,Immersion gold,Flash gold, plated silver, OSP
Assembly Type
FPC, FR4, Rigid-flex pcb, mcpcb
Min Assembly Specification
50mm*50mm
Max Assembly Specification
510mm*460mm
Components DIP
01005 Chip/0.35 Pitch BGA
Min device accuracy
+/- 0.04mm
Min footprint distance
0.3mm
Application
Telecommunication, Computer Application, Consumption Electronics