Aplicación
encapsulation of general electronic components and circuit board Otros Nombres
Electronic potting adhesive Clasificación
Adhesivos de doblecomponente Viscosity of component a MPa. S / 25 ℃
Use ratio a: B (weight ratio)
Operating time min / 25 ℃
Complete curing time h / 25 ℃
Shear strength (for aluminum) MPa
Dielectric loss tangent (1MHz)
Dielectric constant (1MHz)
Breakdown strength kV / mm